This work presents direct measurements of stress and temperature distribution during the mesoscale microstructural deformation of Inconel-617 (IN-617) during 3-point bending tests as a function of temperature. A novel nanomechanical Raman spectroscopy (NMRS)-based measurement platform was designed for simultaneous in situ temperature and stress mapping as a function of microstructure during deformation. The temperature distribution was found to be directly correlated to stress distribution for the analyzed microstructures. Stress concentration locations are shown to be directly related to higher heat conduction and result in microstructural hot spots with significant local temperature variation.